SysML v2 – Siemens teams up with IBM
Siemens and IBM partner to support SysML v2
Siemens is partnering with IBM to develop the next generation of model-based systems engineering (MBSE) solutions for our customers, leveraging the open standard of SysML v2.
Attend this webinar, hosted by IBM and...
Industrial AR across the product lifecycle
In today’s rapidly evolving industrial landscape, industrial augmented reality (AR) is emerging as a breakthrough technology, with proven use cases across the product lifecycle. From design and manufacturing to maintenance and aftersales support, industrial AR isn’t just enhancing existing...
Flexxbotics, Zaptic Win Hexagon’s Third Sixth Sense Cohort of Advanced Manufacturing Startups
NORTH KINGSTOWN, RI, USA, Feb 13, 2024 – Hexagon’s Manufacturing Intelligence division announces Flexxbotics and Zaptic winners of its third ‘Sixth Sense’ cohort. Both were chosen as winners following an intense program for the eight cohort participants that culminated with a pitching competition at the...
Silicon Labs Partners with Arduino
AUSTIN, TX, Feb 12, 2024 – Silicon Labs, a leader in secure, intelligent wireless technology for a more connected world, today announced a new partnership in collaboration with Arduino, the global leader in open-source hardware and software, to better enable seamless development...
Siemens to Add New Generative AI Functionality in Senseye Predictive Maintenance
NUREMBERG, Germany, Feb 6, 2024 – Siemens is releasing a new generative artificial intelligence (AI) functionality into its predictive maintenance solution – Senseye Predictive Maintenance. This advance makes predictive maintenance more conversational and intuitive. Through this new release of...
OptConnect Acquires M2M DataGlobal
KAYSVILLE, UT, Feb 6, 2024 – OptConnect, a longtime leader in managed wireless services, today announced it has acquired Latin America-based M2M DataGlobal (M2M), one of the largest and most professionally run IoT organizations in Latin America. Together these businesses create a premier managed wireless connectivity...
Siemens Innovates Sinamics S210 Servo Drive System with New Hardware and Software for Larger...
NUREMBERG, Germany, Jan 15, 2024 – Siemens is innovating the well-established Sinamics S210 servo drive system with a new hardware architecture and new V6 software generation that expand the system’s range of applications. The servo drive system is especially...
Outsight, PreAct Join to Advance Smart Infrastructure, People Flow Monitoring with Spatial AI
LAS VEGAS, NV, USA, Jan 10, 2024 – CES 2024 – Outsight, the leading innovator in 3D Spatial AI Software Solutions, has joined forces with PreAct Technologies, a trailblazer in near-field flash LiDAR technology, to revolutionize the fields of...
Telit to Unveil NExT Connected Module Packages at CES
IRVINE, CA, Jan 8, 2024 – Telit Cinterion, an end-to-end IoT solutions enabler, is set to unveil a pair of connected module packages at the upcoming CES 2024 in Las Vegas. Building upon the company’s 20-plus years in the IoT space, this...
New Electronics – NXP and MicroEJ use software containers to accelerate embedded platform development
NXP Semiconductors has announced the NXP Platform Accelerator, developed in collaboration with MicroEJ.
The Platform Accelerator leverages MICROEJ VEE software containers with standard APIs and enables a smartphone-like software design process experience for the industrial and IoT edge.
The use of...